SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
The SP1012 series TVS diode array is the most densely designed ESD protection device on the market today. It packs five ESD diodes in a 0402-size (0.94 x 0.61-mm) flip-chip package that would normally ...
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...
Geneva, October 09,2008 – By combining EMI filtering and ESD protection for 10 high-speed signal lines in a 1.98 x 2.08 mm flip-chip package, the EMIF10-LCD03F3 from STMicroelectronics (NYSE: STM), ...
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